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              技术服务

              Design services

              来源: 发布时间:2016/4/15 16:21:48 浏览次数:0

                 

              HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

                  Package Design Team services include:

              ?  Customer-centric design.

              ?  High quality, reliable, and cost effective packaging proposal.

              ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

              ?  Supporting auto- check of design and Drawings.

              Design Capabilities:

                 Multi-Chip ModulesMCM

                 System-in-Package (SiP)

                 Flip Chip Package

                 Hybrid Package

                 Package-in-Package (PiP)

                 Package-on-Package (PoP)

                 Embedded Package

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